Product features:
1. Applicable size: 2-8 inch silicon, silicon carbide, sapphire and other substrate substrates;
2. Compatible size: Two specifications connected can be used on the same device;
3. Program control: PLC or industrial computer can be selected for equipment control;
4. Operation interface: There are other optional configurations in Chinese, English, etc;
5. Pure water cleaning: Select whether to turn on the 18 megawatt pure water system for use;
6. Nitrogen drying: choose to use cold/hot nitrogen gas;
7. Speed selection: Select between 0-2800rpm;
Equipment competitiveness:
1. Price advantage: raw materials, labor, after-sales
2. Quality: whole machine operation, component quality, assembly process, equipment debugging
3. Appearance: Overall beautiful, detailed treatment, color matching
4. Differentiation: Compatible with customization
5. Customer First: Improve assembly, design, and customer feedback
Deep cooperation with semiconductor component factories, such as FOUP, ceramic grinding discs, quartz tubes, and other manufacturers