Product features:
Third generation cleaning equipment for 2-12 inch wafers
Suitable for various material boxes, including PP, PVD
Multiple design modes such as front loading/unloading, front loading/unloading, etc
Standard Factory Hot Air Dry Quantity
Hot CDA, N2 drying optional
Standard DIW cleaning container
Minimum footprint design for cleanroom
Design for maximizing production capacity
Strong technical support and complete spare parts
Low maintenance cost and low failure rate
Manual retrieval and placement of boxes, can be designed according to customer requirements
Automated washing and drying, one click start
Human machine interface control parameters
Equipment competitiveness:
1. Price advantage: cost control (raw materials, labor, after-sales), profit proportion
2. Quality: whole machine operation, component quality, assembly process, equipment debugging
3. Delivery time: component delivery time, assembly time, debugging time
4. Appearance: Overall beautiful, detailed treatment, color matching
5. Differentiation: Compatible with customization
6. Customer First: Improve assembly, design, and customer feedback
Deep cooperation with semiconductor component factories, such as FOUP ceramic grinding discs, quartz tubes, and other manufacturers